• Max No of layer - 12
• Max Board Size(mm) - 415mm x 585mm
• Board Thickness(mm) - 0.2 mm to 3.20 mm
• Base Material - FR1, CEM1-4, FR4, High TG (on Demand)
• Inner Layer Copper Cladding -
  Max. Cu wt. for Planes 70μ
  Max. Cu wt. for Signals 70μ
  Min. Cu wt. 18μ
  
• Circuit Layer (in mm) Inner Layer -
  For start copper thickness of 18μ min Track Width - 0.15mm (6 mil)
  min track spacing - 0.15mm (6 mil)
  For start copper thickness of 35μ min Track Width - 0.20mm
  min track spacing - 0.20mm
  For start copper thickness of 70μ min Track Width - 0.25mm
  min track spacing - 0.25mm
  

Drilling :

• Blind and Buired vias manufacturable - Yes
• Drill to track Clearance for inner layer (upto 6 Layers)- 0.30 mm
• Drill to Track clearance for inner layer ( > 6 Layers)- 0.40 mm

Layer Construction

:

• Min. Core Thickness - 0.15 mm
• Min. Dielectric thickness - 0.15 mm

Copper Cladding :

• Max. Copper thickness - 140μ
• Min. Copper thickness - 35μ

Drilling (All Values are in mm) for Single/Double/Multilayer :

Specification

• a) Min. finished via hole size - 0.20mm
• b) Min. finished via pad size - 0.50mm
• c) Min. annular ring - 0.15mm
• d) Drill to drill clearance - 0.20mm
• e) Min. slot size for PTH slots (Tool size) - 0.70mm
• g) Min. drill size for plated holes on board edge - 0.80mm
• h) Min. drill to drill clearance for plated holes on board edge - 0.80mm

Surface Finish :

Specification Availability

• a) HAL (Leaded & Lead free) - YES
• b) Electrolytic Gold / Nickel - YES
• c) Electroless Nickle / Gold - YES
• d) Immersion Silver - YES
• e) Immersion Tin - YES
• f) SMOBC with OSP - YES

Solder Mask :

Specification Availability

• a) Mask opening - 0.2 mm
• b) Min. soldermask web width between pads - 0.2 mm
• e) SM to trace clearance - 0.10 mm
• f) Via fill max drill size - 0.40 mm
• g) Mask Color availability - Green, Black, White, Blue, Red

Legend :

Specification Value

• a) Legend line width - 0.15 mm to 0.20 mm
• b) Min. character height - 1.00 mm

Scoring :

Specification Value

• a) Angle for v-cut - 30 degree
• b) Jump scoring - Yes

Routing :

Specification Value

• Min. router size - 0.80 mm

Copper Clearance from PCB Edge :

Specification Value

• a) For routing - 0.4 mm
• b) For scoring - 0.5 mm
• c) For inner layer - 0.5 mm

Carbon :

Specification Value

• a) Min. line width - 0.30 mm
• b) Min. carbon – carbon spacing - 0.25 mm

Peelable :

Specification Value

• a) Minimum width of any Peel-off element - 1.00 mm
• b) Maximum coverable hole ENDSIZE - 4.00 mm

Drill Tolerances :

PTH Hole Size   PTH Tolerance    NPTH Hole Size   NPTH Tolerance

0.50-3.50 mm         +/- 0.075 mm       <3 mm                   +/- 0.05 mm

>3.50 mm               +/- 0.10mm          >3 mm                   +/- 0.10 mm

Other Tolerances :

• PCB Size - +/- 0.20 mm
• PCB Thickness - +/- 20% (Up to 0.8 mm thickness)
• +/- 10% (Above 1.0 mm thickness)
• Trace Width / Spacing - +/- 10 %
• Copper Thickness Inside Hole - >= 20 um
• Bow & twist tolerance - +/- 1%