Design Range :

• Single sided / Double sided / Multilayer / Thermal Bonded designs
• Complex/High Speed Multilayer PCB designs with split planes, Bus routing, differential pairs, matched lengths etc.
• High density SMT designs (BGA, uBGA, PCI, PCIE, CPCI…..)
• High-Density Interconnect (HDI)—buried via, micro via, via-in-pad, fine-line.
• Fine line and BGA Designs.
• FPGA / CPLD / DSP / Microcontroller based Designs.
• Analog, Digital or Mixed designs.
• Low level analog designs for metering
• Ultra low EMI designs for MRI applications
• High frequency RF / Microwave PCB designs
• Memory cards (RAM) designs
• Printed antenna designs
• Flex / Rigid Flex Designs
• Metal Core/Clad (Power LED PCB) designs

Quality Aspects :

• Signal Integrity/EMC/EMI – Our thorough understanding of high speed signaling techniques ensures signal integrity requirements are met.
• Thermal / Reliability Analysis – Analyze all major heat-transfer mechanisms, including convection, conduction, and radiation.
• Signal timing sensitive layouts – Many designs require timing (length) control of high speed signals. We control absolute and relative lengths of nets, including internal die delays if necessary.
• Impedance control – Impedance control, either single ended or differential, is required for most high speed signals. With the good design practice and knowledge of impedance control, we keep designs within their requirements.
• Cross-talk reduction with parallel design
• Design for manufacturing is followed with In-house Quality checking
• PCBs designed to MIL/IPC/UL specifications
• New Parts created are checked and documented.
• Modification done during the design process is recorded.
• Checking of input data, libraries, mechanical dimensions, placement, routing, Gerber data etc.
• Customer feedback and design modifications are documented.

Laser Cut Stencils

Stencil is the most significant tool in Surface Mount Technology assembly process, as it is related to application of solder paste to the PCB pads. Though the process appears to be simple, it contributes a major part in the process related defects. Hence, designing and manufacturing of accurate and reliable stencil is an important issue and needs adequate attention. Key criteria in stencil include providing for the dimensionally accurate placement of the apertures and insuring a proper aperture geometry.

Laser stencil process has minimal routing sequences, which reduce manufacturing errors. Such errors as mesh stretching, mesh adhesion to frame, gluing foil to mesh, mounting foil upside down, mesh emulsions and chemical etch tolerances are now taken out of the formula.

Advantages of Laser Cut Stencil over Chemical Etched Stencil.

• Environment friendly production process. No chemical treatment.
• Rapid Data transmission via E-mail
• High process reliability through laser technology.
• Economic production process without film costs.
• Short Production time.
• Smooth internal pad walls.
• High Pad positional accuracy.
• Stencil to PCB registration (caused by film distortion).
• Clean and exact printing image of the solder paste.
• Fine-pitch screen.